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Patent Searching and Data


Title:
ポリアミド酸樹脂組成物およびその製造方法
Document Type and Number:
Japanese Patent JP5772601
Kind Code:
B2
Abstract:
The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A', C, C' are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A', or C, C'. A-B-A'(1) C-D-C'(2)

Inventors:
Miyazaki Daichi
Ichito Miyoshi
Masao Tomikawa
Application Number:
JP2011554323A
Publication Date:
September 02, 2015
Filing Date:
December 21, 2011
Export Citation:
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Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C08G73/10; C08K3/00; C08L79/08
Domestic Patent References:
JPS6281421A1987-04-14
JPH02150453A1990-06-08
JPH02150452A1990-06-08
JP2002317046A2002-10-31
JP2009067859A2009-04-02
JPH06322129A1994-11-22
JPH0229432A1990-01-31
JPS62117815A1987-05-29
JPS6281421A1987-04-14
JPH02150453A1990-06-08
JPH02150452A1990-06-08
JP2002317046A2002-10-31
JP2009067859A2009-04-02
JPH06322129A1994-11-22
JPH0229432A1990-01-31
JPS62117815A1987-05-29