Title:
固体撮像装置、及び固体撮像装置の製造方法
Document Type and Number:
Japanese Patent JP5783741
Kind Code:
B2
Abstract:
A solid-state image pickup device (100) includes a semiconductor substrate (101) in which photoelectric conversion units (103a, 103b) are arranged. An insulator (104) is disposed on the semiconductor substrate. The insulator has holes (105a, 105b) associated with the respective photoelectric conversion units. Members (106a, 106b) are arranged in the respective holes. A light-shielding member (108) is disposed on the opposite side of one of the members from the semiconductor substrate, such that only the associated photoelectric conversion unit is shielded from light. In the solid-state image pickup device, the holes are simultaneously formed and the members are simultaneously formed.
Inventors:
Shimotsu Samineo
Masahiro Kobayashi
Masahiro Kobayashi
Application Number:
JP2011026352A
Publication Date:
September 24, 2015
Filing Date:
February 09, 2011
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L27/146; H01L27/14; H04N5/369
Domestic Patent References:
| JP2010098330A | ||||
| JP2008177221A | ||||
| JP2009111225A | ||||
| JP2010238726A | ||||
| JP2007201091A | ||||
| JP2007141873A |
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa
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