Title:
熱電モジュール
Document Type and Number:
Japanese Patent JP5794872
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoelectric module for suppressing peeling of a metal layer to suppress occurrence of cracks.SOLUTION: A thermoelectric module of the present invention includes: a pair of support substrates 1; and a plurality of thermoelectric elements arranged between one principal planes facing each other in the pair of support substrates 1. Each of the support substrates 1 includes: an insulation plate 11; a first metal layer 31 provided on a one principal plane side of the insulation plate 11; and a second metal layer 32 provided on another principal plane side. An end of the first metal layer 31 and an end of the second metal layer 32 have a thickness that becomes thinner toward an end of the insulation plate 11.
Inventors:
Tomohiro Furukawa
Application Number:
JP2011203261A
Publication Date:
October 14, 2015
Filing Date:
September 16, 2011
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L35/30; H01L35/32; H02N11/00
Domestic Patent References:
| JP2004063794A | ||||
| JP2002353520A |