Title:
携帯端末
Document Type and Number:
Japanese Patent JP5810295
Kind Code:
B2
Abstract:
To provide a mobile terminal having a board support structure capable of reducing impact on built-in components of the mobile terminal when a housing thereof undergoes a primary mode of deformation. The upper end portion and the lower end portion of a main board 40 are supported by bosses 111a, 111b, 113a, and 113b. The upper end portion and the lower end portion of the main board 40 are fixed in a direction perpendicular to the surface of the main board 40. The upper end portion thereof slides with respect to the peripheries of small-diameter cylindrical portion insertion holes 211a and 211b of a module holding board 30 on the front side and a rear housing 20 on the rear side. Thus, the main board 40 can move in a plane direction (in a longitudinal direction).
Inventors:
Tanaka expansion
Tatsuo Sawada
Tatsuo Sawada
Application Number:
JP2011056063A
Publication Date:
November 11, 2015
Filing Date:
March 15, 2011
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H04M1/02; H05K7/14
Domestic Patent References:
| JP5315772A | ||||
| JP8153982A | ||||
| JP2007180751A |
Attorney, Agent or Firm:
Shinji Kato
Koji Morita
Mamoru Suzuki
Osamu Tsuda
Koji Morita
Mamoru Suzuki
Osamu Tsuda