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Title:
流体処理装置及び処理方法
Document Type and Number:
Japanese Patent JP5821072
Kind Code:
B2
Abstract:
In order to enable the more stable performance of uniform treatment such as reaction by reducing pulsation generated in a fluid introduced between treatment surfaces using a micropump effect, provided is a device for treating an object to be treated between treatment surfaces (1, 2) facing each other of treatment parts which can move close to and away from each other and at least one of which rotates relatively with respect to the other, and performing the treatment by introducing a fluid between the treatment surfaces using a micropump effect by a recessed section (13) formed in at least one of the treatment surfaces (1, 2) and mixing and stirring the fluid between the treatment surfaces. The micropump effect generates force in the direction in which the treatment surfaces (1, 2) move away from each other by the rotation of a treatment part (10) and the recessed section (13) formed in the treatment surface (1) to thereby produce the effect of introducing the fluid between the treatment surfaces (1, 2). The recessed section (13) is formed so as to extend in the circumferential direction and inward/outward direction of the treatment surface (1), and multiple recessed sections (13) are provided or an additional recessed section (±) different from the recessed sections (13) is formed in at least one of the treatment surfaces (1, 2).

Inventors:
Shinichi Enomura
Application Number:
JP2012509715A
Publication Date:
November 24, 2015
Filing Date:
April 08, 2011
Export Citation:
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Assignee:
M Technique Co., Ltd.
International Classes:
B01J19/00; B01F25/60; B01F27/93
Domestic Patent References:
JP2004049957A2004-02-19
JP2004318064A2004-11-11
JP2006341232A2006-12-21
JP4446129B12010-04-07
JP2004049957A2004-02-19
JP2004318064A2004-11-11
JP2006341232A2006-12-21
JP2007321151A2007-12-13
Foreign References:
WO2009008394A12009-01-15
Attorney, Agent or Firm:
Takenobu Samejima



 
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