Title:
電子素子搭載用基板、電子装置および撮像モジュール
Document Type and Number:
Japanese Patent JP5823043
Kind Code:
B2
Abstract:
There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed.
Inventors:
Akihiko Funahashi
Kanae Horiuchi
Yosuke Moriyama
Kanae Horiuchi
Yosuke Moriyama
Application Number:
JP2014527103A
Publication Date:
November 25, 2015
Filing Date:
January 31, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/02; H01L23/04; H01L27/14
Domestic Patent References:
| JP2009170499A | 2009-07-30 | |||
| JP2012160512A | 2012-08-23 | |||
| JP2011238799A | 2011-11-24 | |||
| JP2012119619A | 2012-06-21 | |||
| JP2007173650A | 2007-07-05 | |||
| JP2006201427A | 2006-08-03 | |||
| JP2011018818A | 2011-01-27 | |||
| JP2008042064A | 2008-02-21 |
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