Title:
冷却を伴う機器ラック電力分配システム
Document Type and Number:
Japanese Patent JP5830774
Kind Code:
B2
More Like This:
Inventors:
Ewing, Carrel, W.
Ewing, Brandon
Edway
Ewing, Brandon
Edway
Application Number:
JP2013538867A
Publication Date:
December 09, 2015
Filing Date:
November 09, 2011
Export Citation:
Assignee:
Server Technology Incorporated
International Classes:
H05K7/20
Domestic Patent References:
JP3093295A | ||||
JP2000003137A | ||||
JP5243770A | ||||
JP58145194A | ||||
JP7065869A |
Foreign References:
US20100206515 |
Attorney, Agent or Firm:
Ikeda adult
Masakazu Noda
Kazuhiro Yamaguchi
Masakazu Noda
Kazuhiro Yamaguchi