Title:
半導体装置の製造方法及び接合方法
Document Type and Number:
Japanese Patent JP5830847
Kind Code:
B2
Inventors:
Toshiya Akamatsu
Application Number:
JP2010236433A
Publication Date:
December 09, 2015
Filing Date:
October 21, 2010
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/60
Domestic Patent References:
| JP2002016104A | ||||
| JP2000357714A | ||||
| JP2001035881A | ||||
| JP2007184653A | ||||
| JP2003264205A | ||||
| JP2003258034A | ||||
| JP2011044530A | ||||
| JP5029362A | ||||
| JP63237426A |
Foreign References:
| WO2002076161A1 |
Attorney, Agent or Firm:
Tadahiko Ito
Akinori Yamaguchi
Akinori Yamaguchi