Title:
銅合金
Document Type and Number:
Japanese Patent JP5839126
Kind Code:
B2
Abstract:
A copper alloy according to the present invention is a copper alloy rolled to be plate-shaped. The copper alloy contains 8.5 to 9.5 mass % of Ni, 5.5 to 6.5 mass % of Sn with a remainder being Cu and unavoidable impurities. An average diameter of crystal grains in a cross section perpendicular to a rolling direction is less than 6 μm. A ratio x/y of an average length x of the crystal grains in a plate width direction to an average length y in a plate thickness direction satisfies 1≤x/y≤2.5. An X-ray diffracted intensity ratio in a plate surface parallel to the rolling direction of the copper alloy includes, when an X-ray diffracted intensity of a (220) plane is standardized as 1, an intensity ratio of a (200) plane being 0.30 or less, an intensity ratio of a (111) plane being 0.45 or less, and an intensity ratio of a (311) plane being 0.60 or less. The intensity ratio of the (111) plane is greater than the intensity ratio of the (200) plane and smaller than the intensity ratio of the (311) plane.
Inventors:
Takefumi Ito
Maeda Chisako
Yoshida Yuji
Kei Saegusa
Takayuki Mizomi
Maeda Chisako
Yoshida Yuji
Kei Saegusa
Takayuki Mizomi
Application Number:
JP2014526668A
Publication Date:
January 06, 2016
Filing Date:
July 26, 2012
Export Citation:
Assignee:
Mitsubishi Electric Corporation
Mitsubishi Electric Metex Co., Ltd.
Mitsubishi Electric Metex Co., Ltd.
International Classes:
C22C9/06; C22F1/08; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
| JPS63266055A | 1988-11-02 | |||
| JPS63317636A | 1988-12-26 | |||
| JP2009242895A | 2009-10-22 | |||
| JP2002180165A | 2002-06-26 | |||
| JPS63266055A | 1988-11-02 | |||
| JPS63317636A | 1988-12-26 | |||
| JP2009242895A | 2009-10-22 | |||
| JP2002180165A | 2002-06-26 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno