Title:
基材を用いた積層造形法
Document Type and Number:
Japanese Patent JP5849350
Kind Code:
B2
Abstract:
The invention relates to a substrate-based method for forming a three-dimensional object by additive fabrication by coating a liquid radiation curable resin comprising from 30 to 80 wt % of cationically curable compounds on a substrate, contacting the liquid radiation curable resin with a previously cured layer, selectively exposing the layer of liquid radiation curable layer to actinic radiation thereby forming a cured layer, separating the cured layer at the substrate, and repeating the steps a sufficient number of time in order to build up a three-dimensional object.
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Inventors:
Chi, Chikon
Dake, Ken
Dake, Ken
Application Number:
JP2012544820A
Publication Date:
January 27, 2016
Filing Date:
December 16, 2010
Export Citation:
Assignee:
DSM IP ASSETS B.V.
International Classes:
B29C67/00; B33Y10/00; B33Y30/00; B33Y70/00
Domestic Patent References:
| JP2007530724A | ||||
| JP2001205708A | ||||
| JP2007296853A |
Attorney, Agent or Firm:
Ikeda adult
Kazuhiro Yamaguchi
Masakazu Noda
Yoshinori Shimizu
Kazuhiro Yamaguchi
Masakazu Noda
Yoshinori Shimizu