Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP5851599
Kind Code:
B2
Abstract:
The objective of the present invention is to obtain a highly reliable power module by reducing the temperature of a control board by increasing the heat radiating properties of the control board and reducing heat input from another control board or a power semiconductor element to the control board. The power module (20) is characterized by a power semiconductor element (1), which is mounted to a base board (2), and one or more control boards (6), which control the power semiconductor element (1), being disposed within a case (4), and at least one control board (6) being disposed approximately perpendicular to the mounting surface of the base board (2) to which the power semiconductor element (1) has been mounted.
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Inventors:
Hiroyuki Waku
Koji Yoshise
Koji Yoshise
Application Number:
JP2014515561A
Publication Date:
February 03, 2016
Filing Date:
April 26, 2013
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP98223A | ||||
| JP2001237368A | ||||
| JP200999927A | ||||
| JP2000228492A |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa