Title:
タッチパネルモジュール及び電子情報機器
Document Type and Number:
Japanese Patent JP5860996
Kind Code:
B2
Abstract:
In a touch panel module, speed up of reaction speed for an input operation, lower current consumption, and suppression of generation of heat in a sensor electrode are enhanced by attaining lower resistance of the sensor electrode. A touch panel module 100 comprises a sensor section 110 for detecting an input operation, and peripheral wiring sections 120a and 120b disposed at the periphery of the sensor section, wherein: a sensor section substrate 111 constituting the sensor section and a peripheral wiring section substrate 121 constituting the peripheral wiring sections are separate substrates; a plurality of sensor section wirings 112a and 112b included in the sensor section are formed with a metal film having lower resistance compared to a conductive film constituting a plurality of peripheral wirings 122a and 122b of the peripheral wiring section; and peripheral wirings are formed with a transparent conductive film having a smaller minimum processing pattern width and a smaller minimum processing pattern pitch compared to the metal film constituting the sensor section wirings.
Inventors:
Hiromasa Tsukamoto
Nakamura Nakaei
Nobuaki Asayama
Nakamura Nakaei
Nobuaki Asayama
Application Number:
JP2015512300A
Publication Date:
February 16, 2016
Filing Date:
April 07, 2014
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G06F3/041; G06F3/044
Domestic Patent References:
| JP2009251785A | 2009-10-29 | |||
| JP2010061502A | 2010-03-18 | |||
| JP2012018634A | 2012-01-26 | |||
| JP2014085771A | 2014-05-12 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Etsuko Isoe
Toshiyuki Yamazaki
Hiroshi Yamazaki
Etsuko Isoe
Toshiyuki Yamazaki