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Patent Searching and Data


Title:
微小機械素子及びその設計方法
Document Type and Number:
Japanese Patent JP5877242
Kind Code:
B2
Abstract:
The invention relates to a micromechanical device comprising a semiconductor element capable of deflecting or resonating and comprising at least two regions having different material properties and drive or sense means functionally coupled to said semiconductor element. According to the invention, at least one of said regions comprises one or more n-type doping agents, and the relative volumes, doping concentrations, doping agents and/or crystal orientations of the regions being configured so that the temperature sensitivities of the generalized stiffness are opposite in sign at least at one temperature for the regions, and the overall temperature drift of the generalized stiffness of the semiconductor element is 50 ppm or less on a temperature range of 100° C. The device can be a resonator. Also a method of designing the device is disclosed.

Inventors:
Mika Prunilla
Anti Jacola
Tuomas Pensara
Application Number:
JP2014510842A
Publication Date:
March 02, 2016
Filing Date:
May 11, 2012
Export Citation:
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Assignee:
TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
International Classes:
H03H9/24; B81B3/00; B81B7/02; H03H3/007
Domestic Patent References:
JP2001507885A
JP2006524020A
JP2009521176A
JP2010162629A
JP2007005909A
JP2010045333A
JP2010022000A
JP2009055294A
JP2007505543A
Foreign References:
WO2010147772A1
WO2011042597A1
WO2010062847A2
WO2010015963A1
Attorney, Agent or Firm:
Kenji Sugimura
Makoto Fukuo
Hidetoshi Kohara