Title:
弾性パッド複合材料及び製造方法
Document Type and Number:
Japanese Patent JP5889343
Kind Code:
B2
Abstract:
The present application discloses a composite pad structure that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure.
Inventors:
Kim, daniel
Application Number:
JP2014003223A
Publication Date:
March 22, 2016
Filing Date:
January 10, 2014
Export Citation:
Assignee:
Applied FT Composite Solutions, Inc.
International Classes:
B32B3/06
Domestic Patent References:
| JP2050253U | ||||
| JP49125110U | ||||
| JP2008111213A | ||||
| JP2006239394A | ||||
| JP50135412U |
Attorney, Agent or Firm:
Yusuke Hiraki
Satoshi Fujita
Eiichi Arai
Natsuo Tanaka
Satoshi Fujita
Eiichi Arai
Natsuo Tanaka