Title:
ボンディングヘッドエレメントの位置合わせ方法及び超音波ボンダー
Document Type and Number:
Japanese Patent JP5921062
Kind Code:
B2
Abstract:
Method for carrying out adjustment work on a bonding head (1) in which a bonding head element is positioned relative to a reference element, especially an ultrasonic tool (3). A camera (8) is used to image the surroundings of the reference element, particularly the tip of the ultrasonic tool. The image is output to a display, whereby a marking is blended into the display image for use as a positioning aid. An independent claim is made for an ultrasonic bonder with a bonding head that has an ultrasonic tool. The ultrasonic bonder has a camera that is used to support positioning of a bond head element.
Inventors:
Walter, Frank
Application Number:
JP2010231039A
Publication Date:
May 24, 2016
Filing Date:
October 14, 2010
Export Citation:
Assignee:
Hesse Gesellschaft Mito Beschlenktel Haftung
International Classes:
H01L21/607; B23K20/10; H01L21/60
Domestic Patent References:
| JP3183140A | ||||
| JP3114240A | ||||
| JP3114243A | ||||
| JP200377955A | ||||
| JP9162222A | ||||
| JP59177945U | ||||
| JP59117225A | ||||
| JP4315810A | ||||
| JP20002810A | ||||
| JP2003163243A | ||||
| JP200226058A | ||||
| JP2005353901A |
Attorney, Agent or Firm:
Kenji Kuroda
Takashi Matsumoto
Takashi Matsumoto