Title:
樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP5921072
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device that can achieve improvement of productivity, improvement of reliability, and reduction in cost.SOLUTION: A resin-sealed semiconductor device 101 comprises: a semiconductor element 111 in which one electrode is formed on a first surface and two or more electrodes are formed on a second surface; a first lead frame 120 having a first lead 124 and a first die pad 122 for mounting the semiconductor element 111; a second lead frame 130 that is disposed apart from the first lead frame 120 and has a second die pad 132 and a second lead; and a third lead frame 140 having a connection portion 142 and a third lead 144. One electrode of the two or more electrodes formed on the second surface is directly connected to the first die pad 122, the other electrode formed on the second surface is directly connected to the second die pad 132, and the electrode formed on the first surface is connected to the connection portion 142 of the third lead frame 140 via an electrical connector 150.
Inventors:
Toshiyuki Tamate
Application Number:
JP2011048414A
Publication Date:
May 24, 2016
Filing Date:
March 05, 2011
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L21/60; H01L21/56; H01L23/48; H01L23/50
Domestic Patent References:
| JP200377931A | ||||
| JP2008160163A | ||||
| JP2009152364A | ||||
| JP56115542A | ||||
| JP864634A |
Foreign References:
| US6566164 |
Attorney, Agent or Firm:
Seiji Ohno
Hiroyuki Ohno
Seiichi Sakitani
Hiroyuki Ohno
Seiichi Sakitani