Title:
オーバーモールド成形ポリアミド複合構造体及びその製造方法
Document Type and Number:
Japanese Patent JP5932816
Kind Code:
B2
Abstract:
Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.
Inventors:
Andrey E. Area
Olaf Norbert Kirkner
Martin Douglas Wakeman
Shen Mei Yuan
Olaf Norbert Kirkner
Martin Douglas Wakeman
Shen Mei Yuan
Application Number:
JP2013536804A
Publication Date:
June 08, 2016
Filing Date:
October 27, 2011
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
B32B27/34; B32B5/28; C08J5/04
Domestic Patent References:
| JP2009539659A | ||||
| JP2002500576A | ||||
| JP2008260229A |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office