Title:
半導体封止用樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP6300744
Kind Code:
B2
Abstract:
The purposes of the present invention is to provide a resin composition which provides a cured product which has a high glass transition temperature, a low moisture absorption and a good solder reflow property and small heat decomposition in storage at a high temperature for a long time, and has good moldability and good adhesiveness to a Cu lead frame. Thus, the present invention is to provide a composition comprising (A) an epoxy compound represented by the general formula (1); (B) a copolymer obtained by a hydrosilylation between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by the average compositional formula (2); (C) a phenol compound represented by the general formula (3); (D) an inorganic filler; (E) at least one compound selected from the group consisting of organic phosphines, tetra-substituted phosphonium tetraphenylborates and adducts of phosphines and quinones; and (F) a nitrogen-containing heterocyclic compound represented by the formula (I) or a salt thereof represented by the formula (II). Further, the present invention provides a semiconductor device provided with a cured product obtained by curing the composition.
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Inventors:
Shoichi Nagata
Yokota Ryuhei
Sora Oishi
Ikeda Taharu
Yokota Ryuhei
Sora Oishi
Ikeda Taharu
Application Number:
JP2015039003A
Publication Date:
March 28, 2018
Filing Date:
February 27, 2015
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G59/20; C08K3/00; C08K5/3442; C08K5/49; C08L63/00; C08L83/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2006233149A | ||||
| JP62084147A | ||||
| JP5086169A | ||||
| JP4359921A | ||||
| JP2014156607A |
Foreign References:
| WO2013136685A1 | ||||
| WO2012053522A1 |
Attorney, Agent or Firm:
Mitsuo Matsui