Title:
固体撮像装置、および電子機器
Document Type and Number:
Japanese Patent JP6376245
Kind Code:
B2
Abstract:
To easily provide a high-quality laminated image sensor.SOLUTION: A solid-state image pickup device is laminated with: a first semiconductor substrate including a first wiring layer, a photodiode, and at least a transfer transistor, a reset transistor, and an amplifier transistor; a second semiconductor substrate including a second wiring layer and a plurality of transistors; and a third semiconductor substrate including a third wiring layer. The first semiconductor substrate includes a first connection part connected to the first wiring layer. The second semiconductor substrate includes a second connection part extending in a lateral direction on the other side of a surface facing the second semiconductor substrate. The second connection part is connected to the second wiring layer of the second semiconductor substrate and the third wiring layer of the third semiconductor substrate. The plurality of transistors are arranged in a longitudinal direction between opposed surfaces of the second semiconductor substrate.SELECTED DRAWING: Figure 6
Inventors:
Keiji Taya
Hajime Inoue
Ryuichi Kanamura
Taku Umebayashi
Hajime Inoue
Ryuichi Kanamura
Taku Umebayashi
Application Number:
JP2017091571A
Publication Date:
August 22, 2018
Filing Date:
May 02, 2017
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/146; H04N5/369; H04N5/374
Domestic Patent References:
| JP2012015278A | ||||
| JP2011049445A | ||||
| JP2012064709A | ||||
| JP2007228460A | ||||
| JP2012054876A |
Foreign References:
| WO2006129762A1 |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yoshio Inamoto