Title:
配線基板及び電子装置
Document Type and Number:
Japanese Patent JP6379453
Kind Code:
B2
Abstract:
A wiring board (10A) includes a first insulating layer (11a); a first wire (12) that is provided at a first surface of the first insulating layer (11a) and transmits a first signal; and a second wire (13) is provided at a second surface of the first insulating layer (11a) that is opposite to the first surface, includes a first portion that is parallel to at least a portion of the first wire (18), and transmits a first component of the first signal that is transmitted through the first wire.
Inventors:
Tomoyuki Akahoshi
Application Number:
JP2013137722A
Publication Date:
August 29, 2018
Filing Date:
July 01, 2013
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K1/16; H01L21/822; H01L27/04; H05K3/46
Domestic Patent References:
| JP2009111084A | ||||
| JP2001244708A | ||||
| JP2007180292A |
Attorney, Agent or Firm:
Takeshi Hattori