Title:
システムインパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP6384868
Kind Code:
B2
Abstract:
A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is embedded in the laminate body and the semiconductor is bonded to contact pads of the substrate by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.
Inventors:
Bernhard Lange
Jürgen Neuwhistler
Jürgen Neuwhistler
Application Number:
JP2014558928A
Publication Date:
September 05, 2018
Filing Date:
February 25, 2013
Export Citation:
Assignee:
Texas Instruments Japan Ltd.
Texas Instruments Incorporated
Texas Instruments Incorporated
International Classes:
H01L21/52; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2010050189A | ||||
| JP2008166086A | ||||
| JP2006202938A |
Foreign References:
| US8120158 | ||||
| WO2009150875A1 |
Attorney, Agent or Firm:
Kyozo Katayose