Title:
層状ポリマー構造及び方法
Document Type and Number:
Japanese Patent JP6387355
Kind Code:
B2
Abstract:
An optical assembly includes an optical device having an optical surface. The optical assembly further includes an encapsulant that substantially covers the optical surface. The encapsulant has a first layer (106) and a second layer (108). The first layer (106) has a first silicone-containing hot melt composition and a major surface (112). The second layer (108) has a second silicone-containing hot melt composition, the second layer (108) having a second major surface (110) in contact with the first major surface (112).
Inventors:
Steven Swear
Shin Yoshida
Masaaki Amako
Shin Yoshida
Masaaki Amako
Application Number:
JP2015549796A
Publication Date:
September 05, 2018
Filing Date:
December 20, 2013
Export Citation:
Assignee:
Dow Silicones Corporation
DOW CORNING CORPORATION
DOW CORNING CORPORATION
International Classes:
H01L33/56; B32B27/00; H01L33/50; H01L33/54
Domestic Patent References:
| JP2012134564A | ||||
| JP2006269986A | ||||
| JP2004343059A | ||||
| JP2011233315A | ||||
| JP2011134934A | ||||
| JP2007096148A |
Foreign References:
| US20120083056 | ||||
| WO2012040457A1 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama