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Title:
多層プリント配線基板の製造方法及びベース基材
Document Type and Number:
Japanese Patent JP6393619
Kind Code:
B2
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Inventors:
Akimasa Moriyama
Tomoki Kobiki
Masashi Ishii
Application Number:
JP2014539856A
Publication Date:
September 19, 2018
Filing Date:
October 04, 2013
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H05K3/46; B32B15/08; C09K3/00; H05K3/00
Domestic Patent References:
JP2011100935A
JP2009272589A
JP2004169181A
JP200043188A
JP2002292788A
JP200932918A
JP4122644A
JP201129585A
JP200369173A
Foreign References:
US20100096177
WO2013183604A1
WO2014046259A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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