Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6420704
Kind Code:
B2
Abstract:
In wire bonding in assembling of a semiconductor device, an Al wire is coupled to a lead section by a wedge which is a bonding tool, thereafter, the wedge is withdrawn from the top of the lead section and a cutter is lowered and the Al wire is cut off in this state. Lowering of the cutter is stopped at a point in time that a stopper which is lowered simultaneously with lowering of the cutter has truck against the lead section and cutting of the Al wire is terminated by stopping of lowering of the cutter.
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Inventors:
Kazuhiko Okishima
Application Number:
JP2015069375A
Publication Date:
November 07, 2018
Filing Date:
March 30, 2015
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/60
Domestic Patent References:
| JP2011216518A | ||||
| JP2010153499A | ||||
| JP2009147103A | ||||
| JP2012243943A |
Attorney, Agent or Firm:
Tsutsui International Patent Office