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Title:
発光ダイオードの色変換用基板及びその製造方法
Document Type and Number:
Japanese Patent JP6421952
Kind Code:
B2
Abstract:
The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing the color-conversion substrate, the color-conversion substrate of a light-emitting diode comprising: a first substrate and a second substrate arranged facing each other on a light-emitting diode; a sheet, having a hole, arranged in between the first and second substrates; QDs filling the hole; and sealing material disposed in between the first substrate and the lower surface of the sheet and in between the second substrate the upper surface of the sheet, wherein the sealing material is disposed along the edge of the hole, and the sheet is made of a substance allowing laser sealing of the sealing material, first substrate and second substrate.

Inventors:
Lee, Kyon
Moon, Hyunsoo
Oh, Yun Suk
Kim, Jiman
Yang, Chun Bon
Application Number:
JP2016560761A
Publication Date:
November 14, 2018
Filing Date:
March 17, 2015
Export Citation:
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Assignee:
Corning Precision Materials Co., Ltd.
International Classes:
G02B5/20; H01L33/50
Domestic Patent References:
JP2011009450A
JP2012094419A
Foreign References:
WO2012098740A1
US20130094176
Attorney, Agent or Firm:
Nobuyuki Matsunaga
Tetsuji Tsuji