Title:
インテリジェントパワーモジュールの評価方法
Document Type and Number:
Japanese Patent JP6430295
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an intelligent power module capable of detecting a change in the characteristics of a semiconductor chip for power and a method for evaluating the intelligent power module.SOLUTION: An intelligent power module 1 includes: a chip temperature detection circuit 8 for detecting a chip temperature as the temperature of an IGBT chip 10; a case temperature detection circuit 9 for detecting a case temperature as the temperature of a case enclosing the intelligent power module 1; and a memory circuit 6 for recording the chip temperature detected by the chip temperature detection circuit 8 and the case temperature detected by the case temperature detection circuit 9. The memory circuit 6 records the chip temperature and the case temperature at a first timing at which the IGBT chip 10 is driven and the chip temperature and the case temperature at a second timing at which the IGBT chip 10 is driven after the first timing.SELECTED DRAWING: Figure 1
Inventors:
Motonobu Jou
Application Number:
JP2015043367A
Publication Date:
November 28, 2018
Filing Date:
March 05, 2015
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H02M1/00; G01R31/26; H01L23/34; H01L25/07; H01L25/18
Domestic Patent References:
| JP2003169462A | ||||
| JP2003092871A | ||||
| JP2002005989A | ||||
| JP2012070478A | ||||
| JP2013176176A | ||||
| JP2007288999A |
Foreign References:
| WO2013051133A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita