Title:
半導体基板の超音波ウェルディング接合装置
Document Type and Number:
Japanese Patent JP6433618
Kind Code:
B2
Abstract:
The present invention relates to an ultrasonic-welding joining apparatus and, more particularly, to an apparatus for joining, using ultrasonic welding, a lead frame on a DBC substrate of a semiconductor package. The ultrasonic-welding joining apparatus according to the present invention comprises: a lead-frame loading part for supplying a lead frame; a substrate loading part for supplying a DBC substrate; an index rail in which the DBC substrate and the lead frame are seated; an ultrasonic-welding part for joining, using ultrasonic welding, the lead frame and the DBC substrate seated in the index rail; and an unloading part for carrying out the lead frame and the DBC substrate joined by the ultrasonic-welding part.
Inventors:
Choi Yunhwa
Lee Inn Subu
Jo Junte
Choi Sun Son
Lee Inn Subu
Jo Junte
Choi Sun Son
Application Number:
JP2018506061A
Publication Date:
December 05, 2018
Filing Date:
April 12, 2016
Export Citation:
Assignee:
JM Korea Co., Ltd.
International Classes:
H01L21/607; H05K3/32
Domestic Patent References:
| JP2005259880A | ||||
| JP11135543A | ||||
| JP9260415A | ||||
| JP2006128476A | ||||
| JP2012004153A | ||||
| JP2014022445A |
Foreign References:
| KR1020090010441A |
Attorney, Agent or Firm:
Mitsuhiro Kato