Title:
感エネルギー性樹脂組成物
Document Type and Number:
Japanese Patent JP6437095
Kind Code:
B2
Abstract:
The present invention provides an energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. Also provided are a method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition comprises an imidazole compound (A) represented by formula (1a), a resin precursor component (B), and a solvent (S), wherein the resin precursor component (B) is at least one resin precursor component selected from the group consisting of: a monomer component comprising a diamine compound represented by formula (2), a dicarbonyl compound represented by formula (3a) and/or a tetracarboxylic acid dianhydride represented by formula (3b); and a precursor polymer having a repeating unit represented by formula (4).
Inventors:
Kunihiro Noda
Hiroki Chisaka
Shioda Dai
Hiroki Chisaka
Shioda Dai
Application Number:
JP2017509870A
Publication Date:
December 12, 2018
Filing Date:
March 24, 2016
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08L79/08; C08G73/08; C08G73/10; C08K5/3445; C08L79/04; G03F7/004; G03F7/038; G03F7/20
Domestic Patent References:
| JP10330615A | ||||
| JP59223725A | ||||
| JP2017005026A | ||||
| JP2014157310A | ||||
| JP58160351A |
Foreign References:
| WO2013168691A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi