Title:
半導体装置
Document Type and Number:
Japanese Patent JP6445672
Kind Code:
B2
Inventors:
Akihiko Nomura
Application Number:
JP2017251681A
Publication Date:
December 26, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP6349952A | ||||
| JP2000183160A | ||||
| JP2001085434A | ||||
| JP2011054805A |
Foreign References:
| WO2011111308A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda