Title:
半田接続構造、および成膜方法
Document Type and Number:
Japanese Patent JP6454262
Kind Code:
B2
Abstract:
Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42). ( Fig. 1 )
Inventors:
Masaki Hirano
Application Number:
JP2015252077A
Publication Date:
January 16, 2019
Filing Date:
December 24, 2015
Export Citation:
Assignee:
Tatsuta Electric Wire Co., Ltd.
International Classes:
C23C24/04; C23C28/02
Domestic Patent References:
| JP2011212684A | ||||
| JP2011029323A | ||||
| JP2006319146A |
Attorney, Agent or Firm:
Harakenzo world patent & trademark