フィルム材およびこれを用いた電子部品ならびに電子部品の製造方法

Title:

フィルム材およびこれを用いた電子部品ならびに電子部品の製造方法

Document Type and Number:

Japanese Patent JP6455784

Kind Code:

B2

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Inventors:

Koji Motomura

Application Number:

JP2015063429A

Publication Date:

January 23, 2019

Filing Date:

March 25, 2015

Export Citation:

Assignee:

Panasonic IP Management Co., Ltd.

International Classes:

B32B5/28

Domestic Patent References:

Foreign References:

WO2015134684A1

Attorney, Agent or Firm:

Kawasaki/Hashimoto Patent Office
Shinichi Kawasaki
Yuko Tsumura

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