Title:
半導体素子の製造方法
Document Type and Number:
Japanese Patent JP6467336
Kind Code:
B2
Inventors:
Yoshifumi Muramoto
Nakajima Fumito
Keiho Maeda
Hiroaki Sanjo
Nakajima Fumito
Keiho Maeda
Hiroaki Sanjo
Application Number:
JP2015240497A
Publication Date:
February 13, 2019
Filing Date:
December 09, 2015
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01L21/308
Domestic Patent References:
| JP2003133326A | ||||
| JP2001077402A | ||||
| JP2004505239A | ||||
| JP5198554A | ||||
| JP62081085A |
Foreign References:
| WO2014017063A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office