Title:
スクライブ方法
Document Type and Number:
Japanese Patent JP6471491
Kind Code:
B2
Abstract:
In the present invention, machining precision of a scribe line is improved. Provided is a scribe method comprising step (a) and step (b). In step (a), a first scribe line is formed on a surface of a substrate (W) by a first cutter (1). During step (a), the first cutter (1) is arranged on the surface side of the substrate (W), and is loaded in the direction facing the substrate (W). In step (b), a second scribe line is formed on a lower part of the substrate (W) by a second cutter (2). During step (b), the second cutter (2) is arranged on the lower side of the substrate (W), and is fixated in the direction facing the substrate (W).
Inventors:
Masanobu Soyama
Application Number:
JP2014260021A
Publication Date:
February 20, 2019
Filing Date:
December 24, 2014
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00
Domestic Patent References:
| JP2012240902A |
Foreign References:
| FR608181A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation