Title:
半導体集積回路
Document Type and Number:
Japanese Patent JP6475093
Kind Code:
B2
Inventors:
Kengo Shima
Application Number:
JP2015112344A
Publication Date:
February 27, 2019
Filing Date:
June 02, 2015
Export Citation:
Assignee:
Tokai Rika Electric Co., Ltd.
International Classes:
H01L27/06; H01L21/761; H01L21/822; H01L21/8238; H01L21/8249; H01L27/04; H01L27/092
Domestic Patent References:
| JP59501766A | ||||
| JP8111506A | ||||
| JP2008140824A | ||||
| JP62073760A | ||||
| JP1305560A | ||||
| JP58048960A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda