Title:
電気めっきシステム
Document Type and Number:
Japanese Patent JP6502628
Kind Code:
B2
Abstract:
Disclosed herein are electroplating systems for electroplating nickel onto a semiconductor substrate having an electroplating cell for holding an electrolyte solution during electroplating which includes a cathode chamber and an anode chamber configured to hold a nickel anode, and having an oxygen removal device arranged to reduce oxygen concentration in the electrolyte solution as it is flowed to the anode chamber during electroplating and during idle times when the system is not electroplating. Also disclosed herein are methods of electroplating nickel onto a substrate in an electroplating cell having anode and cathode chambers, which include reducing the oxygen concentration in an electrolyte solution, flowing the electrolyte solution into the anode chamber and contacting a nickel anode therein, and electroplating nickel from the electrolyte solution onto a substrate in the cathode chamber, wherein the electrolyte solution in the cathode chamber is maintained at a pH of between about 3.5 and 4.5.
Inventors:
Brian El. Bucareau
Thomas A. Ponswami
Ben Foley
Stephen Tea. Meyer
Thomas A. Ponswami
Ben Foley
Stephen Tea. Meyer
Application Number:
JP2014158336A
Publication Date:
April 17, 2019
Filing Date:
August 04, 2014
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
C25D17/06; C25D7/12; C25D17/00
Domestic Patent References:
| JP2005320631A | ||||
| JP1159395A |
Foreign References:
| WO2001068952A1 | ||||
| US20120175263 |
Attorney, Agent or Firm:
Meisei International Patent Office