Title:
導電材料及び接続構造体
Document Type and Number:
Japanese Patent JP6533427
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive material capable of efficiently arranging a solder in a conductive particle on an electrode and enhancing conduction reliability between electrodes both before and after storage of the conductive material.SOLUTION: The conductive material contains a plurality of conductive particles and a binder, where the conductive particle has a solder in an outer surface part of a conductive part, and an imidazole ring and a group represented by the following formula (1) on the outer surface of the solder of the conductive part, and the imidazole ring is positioned between the outer surface of the solder and the group represented by the formula (1). (1), where R1, R2 and R3 represent each an alkyl group, a hydroxyl group, an alkoxy group or a carboxyl group-containing group.SELECTED DRAWING: Figure 1
Inventors:
Hideaki Ishizawa
Application Number:
JP2015140336A
Publication Date:
June 19, 2019
Filing Date:
July 14, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B1/22; H01B1/00; H01B5/16; H01L21/60; H05K1/14; H05K3/32; H05K3/34
Domestic Patent References:
| JP2007204673A | ||||
| JP2007188727A | ||||
| JP2011003508A | ||||
| JP2010126719A | ||||
| JP2015047614A |
Foreign References:
| WO2013125517A1 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office