Title:
付加製造プロセスを使用する、複合材料特性を有するＣＭＰパッド構造
Document Type and Number:
Japanese Patent JP6545261
Kind Code:
B2
Abstract:
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Inventors:
Badger, Rajib
Krishnan, Casillaman
Oral, Mahendra Sea.
Redfield, Daniel
Redeker, Fred Sea.
Patti Bandra, Nagby.
Menk, Gregory E.
Fan, Jason Gee.
Perry, Russell Edward
Davenport, Robert E.
Krishnan, Casillaman
Oral, Mahendra Sea.
Redfield, Daniel
Redeker, Fred Sea.
Patti Bandra, Nagby.
Menk, Gregory E.
Fan, Jason Gee.
Perry, Russell Edward
Davenport, Robert E.
Application Number:
JP2017520394A
Publication Date:
July 17, 2019
Filing Date:
April 24, 2015
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24B37/22; H01L21/304
Domestic Patent References:
| JP2013515379A | ||||
| JP2001507634A | ||||
| JP2002028849A | ||||
| JP2008546167A |
Foreign References:
| WO2013162856A1 | ||||
| US20050086869 | ||||
| KR20030020658A | ||||
| CN103465155A |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation