Title:
基板ホルダおよびめっき装置
Document Type and Number:
Japanese Patent JP6545585
Kind Code:
B2
Abstract:
A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.
Inventors:
Mitsutoshi Yahagi
Makoto Kimura
Yusuke Tamari
Makoto Kimura
Yusuke Tamari
Application Number:
JP2015180622A
Publication Date:
July 17, 2019
Filing Date:
September 14, 2015
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D17/06; C25D17/08
Domestic Patent References:
| JP2002294495A | ||||
| JP11193499A | ||||
| JP2012062570A |
Foreign References:
| US6159354 | ||||
| US20090107836 |
Attorney, Agent or Firm:
Isamu Watanabe
Tetsuya Hirosawa
Tetsuya Hirosawa