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Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6557134
Kind Code:
B2
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Inventors:
Go Inoue
Shoga Masaoka
Akira Matsuzawa
Kenichi Okada
Takuichi Hirano
Application Number:
JP2015251982A
Publication Date:
August 07, 2019
Filing Date:
December 24, 2015
Export Citation:
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Assignee:
Sumitomo Atex Co., Ltd.
International Classes:
H01L21/8238; H01L21/265; H01L21/76; H01L21/761; H01L21/822; H01L27/04; H01L27/088; H01L27/092
Domestic Patent References:
JP2000031381A
JP11204741A
JP2013222893A
JP2014120527A
JP9511103A
JP2001345428A
Foreign References:
US20060060934
US20070077697
Attorney, Agent or Firm:
Sakaki Morishita
Yusuke Murata
Tomoyuki Miki
Tomisho Teruo



 
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