Title:
パワー半導体モジュール、流路部材、パワー半導体モジュール構造体及び自動車
Document Type and Number:
Japanese Patent JP6569781
Kind Code:
B2
Abstract:
The invention is provided with a metal base plate including a first surface and a second surface and a cooling case including a bottom wall and a side wall formed around the bottom wall, in which one end of the side wall being joined to a second surface side of the metal base plate, and a coolant can be circulated in a space enclosed by the metal base plate, the bottom wall, and the side wall, in which the cooling case has an inlet portion and an outlet portion for the coolant which are connected to either the bottom wall or the side wall and disposed along a peripheral edge of the second surface of the metal base plate, and includes a first flange disposed at an inlet opening side of the inlet portion and a second flange disposed at an outlet opening side of the outlet portion.
Inventors:
Takahiro Koyama
Hirohara Gohara
Hirohara Gohara
Application Number:
JP2018128531A
Publication Date:
September 04, 2019
Filing Date:
July 05, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L25/07; H01L23/473; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
| JP2008206243A | ||||
| JP2008288495A | ||||
| JP2009081993A | ||||
| JP2001326318A | ||||
| JP2011103369A | ||||
| JP2015053410A | ||||
| JP2005166867A | ||||
| JP2014082283A | ||||
| JP2001308246A |
Foreign References:
| WO2008029858A1 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro