Title:
保護テープ、及びこれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6599134
Kind Code:
B2
Abstract:
Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.
More Like This:
| WO/2020/095878 | ADHESIVE COMPOSITION, ADHESIVE LAYER, SHEET AND TAPE |
| WO/2019/152267 | PHOTOLABILE BETA-DICARBONYL COMPOUNDS |
Inventors:
Hironobu Moriyama
Hidekazu Yagi
Tomoyuki Ishimatsu
Katsuyuki Ebisawa
Keiji Honjo
Junichi Kaneko
Hidekazu Yagi
Tomoyuki Ishimatsu
Katsuyuki Ebisawa
Keiji Honjo
Junichi Kaneko
Application Number:
JP2015114338A
Publication Date:
October 30, 2019
Filing Date:
June 04, 2015
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C09J7/24; B32B27/00; C09J7/29; C09J7/38; H01L21/301
Domestic Patent References:
| JP2006128292A | ||||
| JP2003173994A | ||||
| JP2005028734A | ||||
| JP2012169482A |
Foreign References:
| WO2012026431A1 |
Attorney, Agent or Firm:
Nobuhiro Noguchi