Title:
積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法
Document Type and Number:
Japanese Patent JP6601137
Kind Code:
B2
Abstract:
Provided is a laminate substrate that is provided with a transparent base material and a laminate formed on at least one surface of the transparent base material. The laminate includes: a blackened layer containing oxygen, copper, and nickel; and a copper layer. The film thickness of the blackened layer is 15 nm or greater, and the mass ratio O/Ni of the oxygen atoms and nickel atoms contained in the blackened layer satisfies formula (1). Formula (1): 0.1≤O/Ni≤0.8
Inventors:
Hiroto Watanabe
Application Number:
JP2015204642A
Publication Date:
November 06, 2019
Filing Date:
October 16, 2015
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
B32B9/00; B32B15/04; B32B15/20; C23C14/06; C23C14/14; G06F3/041; H01B5/14; H01B13/00
Domestic Patent References:
| JP2008300393A | ||||
| JP2005268688A | ||||
| JP2015069440A | ||||
| JP2015103223A | ||||
| JP2001127485A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito