Title:
テラヘルツ素子モジュール
Document Type and Number:
Japanese Patent JP6618273
Kind Code:
B2
Abstract:
The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.
Inventors:
Toshikazu Mukai
Gold
Ichiru Tsuruta
Gold
Ichiru Tsuruta
Application Number:
JP2015097284A
Publication Date:
December 11, 2019
Filing Date:
May 12, 2015
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H03B7/08
Domestic Patent References:
| JP2005322733A | ||||
| JP2013171966A | ||||
| JP48093248A | ||||
| JP2011124314A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Keishin Terayama
Keishin Terayama