Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6619187
Kind Code:
B2
Inventors:
Tetsuya Yamamoto
Application Number:
JP2015185720A
Publication Date:
December 11, 2019
Filing Date:
September 18, 2015
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01L21/331; H01L21/8249; H01L27/06; H01L29/732
Domestic Patent References:
| JP8162472A | ||||
| JP8008271A | ||||
| JP2003142613A | ||||
| JP2004207438A | ||||
| JP54179070U |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda