Title:
ワークピース処理システム及びワークピース処理方法
Document Type and Number:
Japanese Patent JP6622806
Kind Code:
B2
Abstract:
A system and method for dynamic heating of a workpiece during processing is disclosed. The system includes an ion source and a plurality of LEDs arranged in an array, which are directed at a portion of the surface of the workpiece. The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece. In some embodiments, the LEDs heat a portion of the workpiece just before that portion is processed by an ion beam. In another embodiment, the LEDs heat a portion of the workpiece as it is being processed. The LEDs may be arranged in an array, which may have a width that is at least as wide as the width of the ion beam. The array also has a length, perpendicular to its width, having one or more rows of LEDs.
Inventors:
Morgan D Evans
Kevin Anglin
DJ Jeffrey Richer
William tee weaver
Jason M Schaller
Robert Brent Wopat
Kevin Anglin
DJ Jeffrey Richer
William tee weaver
Jason M Schaller
Robert Brent Wopat
Application Number:
JP2017531844A
Publication Date:
December 18, 2019
Filing Date:
November 18, 2015
Export Citation:
Assignee:
Varian Semiconductor Equipment Associates, Inc.
International Classes:
H01L21/265; G21K5/04; H01J27/16; H01J37/08; H01L21/26; H05H1/24
Domestic Patent References:
| JP54162452A | ||||
| JP2010109363A | ||||
| JP2004158621A | ||||
| JP2011119297A | ||||
| JP2013511823A | ||||
| JP2008541485A | ||||
| JP2000091231A | ||||
| JP2004536457A | ||||
| JP3248525A |
Foreign References:
| US6106629 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Masaaki Ishikawa
Mitsutsugu Sugimura
Masaaki Ishikawa