Title:
エポキシ樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP6632972
Kind Code:
B2
Abstract:
The present invention relates to an epoxy resin composition containing an alicyclic epoxy compound (A), a polymer polyol having two or more terminal hydroxyl groups (B), and a Lewis acid-amine complex (C). The present invention provides an epoxy resin composition which can be cured by heating at low temperatures, and suppresses heat generation associated with curing (heat generation by curing). It is preferable that the epoxy resin composition further contains an antioxidant. Furthermore, it is preferable that the antioxidant is a phosphite ester compound.
Inventors:
Takashin Obata
Application Number:
JP2016521104A
Publication Date:
January 22, 2020
Filing Date:
May 19, 2015
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C08G59/68; C08G59/72; C08J9/32; C08K3/36; C08K5/524; C08K7/28; C08L63/00
Domestic Patent References:
| JP59011317A | ||||
| JP5078639A | ||||
| JP11301149A | ||||
| JP2001039063A | ||||
| JP2003238770A | ||||
| JP2012001689A |
Foreign References:
| WO2012029425A1 | ||||
| WO2013183667A1 |
Attorney, Agent or Firm:
Goto Patent Office