Title:
半導体レーザモジュール及びその製造方法
Document Type and Number:
Japanese Patent JP6639949
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser module in which the deviation in optical axis of a fiber or the damage of a ferrule does not occur easily.SOLUTION: A laser module 1 includes: a bottom plate 10; a laser element 16 that can emit a laser beam; a condensing lens 20 that can condense the laser beam; an optical fiber 22 that propagates the laser beam emitted from the laser element 16; a ferrule 24 that holds the optical fiber 22; and a cover body 12 that houses the laser element 16 and the condensing lens 20 on the inside. The cover body 12 is provided with an opening 128 to extend the ferrule 24 to the outside. The laser module 1 includes a cap member 40 that covers the opening 128 from the outside of the cover body 12, and sealing resins 51 to 53 for sealing a space S inside the cover body 12. The cap member 40 is provided with an insertion hole 43 through which the ferrule 24 is inserted.SELECTED DRAWING: Figure 1
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Inventors:
Yoshino Gento
Application Number:
JP2016033227A
Publication Date:
February 05, 2020
Filing Date:
February 24, 2016
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
G02B6/42; H01S5/022
Domestic Patent References:
| JP2007149932A | ||||
| JP4168406A | ||||
| JP2013135020A |
Foreign References:
| US20030081640 |
Attorney, Agent or Firm:
Tomohiro Mori