Title:
プラズマ処理装置及びプラズマ処理データを解析する解析方法
Document Type and Number:
Japanese Patent JP6643202
Kind Code:
B2
Abstract:
According to the present invention, a plasma processing apparatus includes an analysis unit that obtains wavelengths of the light correlated with a plasma processing result, selects, from the obtained wavelengths, a wavelength having a first factor that represents a deviation in an intensity distribution of the light and is larger than a first predetermined value, and predicts the plasma processing result using the selected wavelength, or an analysis unit that obtains values computed using each of light intensities of a plurality of wavelengths and correlated with the plasma processing result, selects, from the obtained values, a value having a second factor that represents a deviation in a distribution of the obtained values and is larger than a second predetermined value, and predicts the plasma processing result using the selected value.
Inventors:
Ryoji Asakura
Daisuke Shiraishi
Akira Kagoshima
Tomomi Inoue
Daisuke Shiraishi
Akira Kagoshima
Tomomi Inoue
Application Number:
JP2016142933A
Publication Date:
February 12, 2020
Filing Date:
July 21, 2016
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
| JP2016025145A | ||||
| JP2015061005A | ||||
| JP2011233713A | ||||
| JP2013161913A | ||||
| JP2016119473A | ||||
| JP2004039805A | ||||
| JP2005241646A |
Attorney, Agent or Firm:
Yuji Toda