Title:
減圧処理装置及びウエーハの保持方法
Document Type and Number:
Japanese Patent JP6649689
Kind Code:
B2
Abstract:
In a state in which a wafer held by a holding portion contacts with an attraction face of an electrostatic chuck after a loading unit loads the wafer into a chamber, the holding portion is connected to ground and a DC voltage is applied to a lower electrode. Then, the holding portion cancels the attraction of the wafer and is spaced away from the wafer thereby to charge the electrostatic chuck and the wafer with electric charge different in polarity from each other such that the wafer is attracted and held by the attraction face.
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Inventors:
Eiichi Iida
Application Number:
JP2015051885A
Publication Date:
February 19, 2020
Filing Date:
March 16, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/3065; H01L21/677; H01L21/683; H02N13/00
Domestic Patent References:
| JP3211753A | ||||
| JP2013161899A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office