Title:
超音波デバイス、超音波モジュール、及び超音波測定装置
Document Type and Number:
Japanese Patent JP6665667
Kind Code:
B2
Abstract:
An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.
Inventors:
Hiroshi Miyazawa
Hiroshi Ito
Yusuke Nakamura
Yamada Masaka
Kiyose Setouchi
Hiroshi Funasaka
Hiroshi Ito
Yusuke Nakamura
Yamada Masaka
Kiyose Setouchi
Hiroshi Funasaka
Application Number:
JP2016090953A
Publication Date:
March 13, 2020
Filing Date:
April 28, 2016
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H04R17/00; A61B8/14; H01L41/04; H01L41/09; H01L41/113
Domestic Patent References:
| JP2013005137A | ||||
| JP2011234073A | ||||
| JP2002085361A |
Foreign References:
| WO2016002971A1 | ||||
| US20110062535 | ||||
| WO2009078208A1 |
Attorney, Agent or Firm:
Intellectual Property Office